Samsung patents material that lowers heat needed for chip insulation
Samsung describes a method for creating a specific type of insulating material called a perovskite dielectric. The process adds a small amount of a second material to help the insulator form at a lower temperature, which could make manufacturing more efficient.
In the filing’s own words
Disclosed are a high-dielectric and method of manufacturing the same, a target material used for manufacturing the high-dielectric, an electronic device including the high-dielectric, and an electronic apparatus including the electronic device. The high-dielectric includes a first material including oxygen and at least two components, and a second material different from the first materials. The first material is a dielectric having a dielectric constant greater than a dielectric constant of silicon oxide, and the second material is an element for reducing a crystallization temperature of the first material. The content of the second material with respect to the first material may be within a range that does not deteriorate leakage current characteristics of the first material. The content of the second material may be in a range of about 0.1 atomic % to about 10 atomic %, about 0.1 atomic % to about 8.5 atomic %, or about 0.1 atomic % to about 2 atomic %.
What exactly they claim (claim 1)
1. A method of manufacturing a high-dielectric, the method comprising: supplying a source material such that a perovskite dielectric having a dielectric constant greater than a dielectric constant of silicon oxide is formed; and supplying a material for reducing a crystallization temperature of the perovskite dielectric while maintaining dielectric properties of the perovskite dielectric.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- DIELECTRIC HAVING HIGH-DIELECTRIC CONSTANT, METHOD OF MANUFACTURING THE SAME, TARGET MATERIAL FOR MANUFACTURING THE DIELECTRIC, ELECTRONIC DEVICE INCLUDING THE DIELECTRIC, AND ELECTRONIC APPARATUS INCLUDING THE ELECTRONIC DEVICE
- Publication number
- US20260282404A1
- Application number
- 19648208
- Filed
- Apr 15, 2026
- Published
- Sep 17, 2026
- Inventors
- 6
- Claims
- 14
Classified under
H10D 1/684 Electricity & electronicsC23C 14/088 Chemistry & metalsC23C 14/3414 Chemistry & metalsC23C 16/06 Chemistry & metalsC23C 16/45527 Chemistry & metalsC23C 28/32 Chemistry & metalsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.