Samsung patents memory layout with extra wiring between cells
Samsung has filed a patent for a specific arrangement of memory cells in a chip. The design adds a 'strap circuit' between vertically stacked memory cells and splits the data lines into three smaller sub-lines to connect them.
In the filing’s own words
A memory device includes a memory cell array including memory cells arranged in a matrix, the memory cell array including a first memory cell and a second memory cell arranged in a column direction, a first bitline and a second bitline connected to the first memory cell and the second memory cell, and a strap circuit provided between the first memory cell and the second memory cell. Each of the first and second bitlines includes a first sub-bitline connected to the strap circuit and the first memory cell, a second sub-bitline connected to the strap circuit and the second memory cell, and a third sub-bitline connected to the strap circuit through the first sub-bitline.
What exactly they claim (claim 1)
1. A memory device comprising: a memory cell array comprising memory cells arranged in a matrix, the memory cell array comprising a first memory cell and a second memory cell arranged in a column direction; a first bitline and a second bitline connected to the first memory cell and the second memory cell; and a strap circuit between the first memory cell and the second memory cell, wherein each of the first and second bitlines comprises a first sub-bitline connected to the strap circuit and the first memory cell, a second sub-bitline connected to the strap circuit and the second memory cell, and a third sub-bitline connected to the strap circuit through the first sub-bitline.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR MEMORY DEVICE WITH STRAP ELEMENT
- Publication number
- US20260282314A1
- Application number
- 19543519
- Filed
- Feb 18, 2026
- Published
- Sep 17, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10B 10/125 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.