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SamsungPatent applicationChips & hardwareInterest 3/10

Samsung patents phone frame with a bump that connects to the circuit board

Samsung describes an electronic device housing made of conductive material that has a specific area sticking out toward the inside. This protruding section is designed to make direct electrical contact with the internal circuit board, creating a connection point between the outer shell and the internal components.

Why it mattersThis filing focuses on how the outer casing of a device can be used as part of the electrical circuit, which is a common technique in electronics design for grounding or signal transmission.

In the filing’s own words

This electronic device may include: a housing having an annular structure and comprising a conductive material; and a substrate arranged to face the inner circumferential surface of the housing spaced apart from the inner circumferential surface of the housing. The housing may include a protruding area formed to protrude toward the substrate and electrically connected to the substrate.

What exactly they claim (claim 1)

1 - 15. (canceled)

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
ELECTRONIC DEVICE COMPRISING HOUSING HAVING A PROTRUDING AREA
Publication number
US20260282251A1
Application number
19551175
Filed
Feb 26, 2026
Published
Sep 17, 2026
Inventors
7
Claims
16

Classified under

H05K 5/0217 Electricity & electronicsH05K 5/0086 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Samsung in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.