Samsung patents thinner camera module design for electronics
Samsung has filed a patent for a camera module that uses a printed circuit board with two different thicknesses. The design places electrical components on the thinner section of the board to help fit the camera into a smaller space.
In the filing’s own words
A camera module according to an embodiment, may include a housing, a lens assembly disposed at least in part inside the housing, and including at least one lens, an image sensor for converting light received through the at least one lens into an electrical signal, a printed circuit board including a first side on which the lens assembly is disposed, a base on which the printed circuit board is disposed, and an electrical element connected to the printed circuit board. The printed circuit board may include a first region having a first thickness, and a second region having a second thickness which is greater than the first thickness. The first region may include a second side facing in a direction opposite to the first side. The electrical element may be disposed to the second side of the first region. Besides, various embodiments obtained from the specification are possible.
What exactly they claim (claim 1)
1. A camera module comprising: a housing; a lens assembly at least partially disposed in the housing, and including at least one lens; an image sensor; a printed circuit board including a first side at which the lens assembly is disposed; a base on which the printed circuit board is disposed; and an electrical element connected to the printed circuit board, wherein the printed circuit board includes a first region having a first thickness, and a second region having a second thickness greater than the first thickness, wherein the first region includes a second side opposite to the first side, and wherein the electrical element is disposed to the second side of the first region.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- CAMERA MODULE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number
- US20260282235A1
- Application number
- 19668481
- Filed
- May 5, 2026
- Published
- Sep 17, 2026
- Inventors
- 8
- Claims
- 15
Classified under
H05K 1/181 Electricity & electronicsH04N 23/51 Electricity & electronicsH04N 23/55 Electricity & electronicsH04N 23/57 Electricity & electronicsH04N 23/687 Electricity & electronicsH05K 2201/09145 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.