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Samsung patents chip method to test data link quality

Samsung describes a method where a chip measures the clarity of a data signal received from another chip. It stores this quality data and shares it with the other device to help adjust the connection settings.

Why it mattersThis improves the reliability of high-speed data connections between computer components by allowing them to check and fix signal quality automatically.

In the filing’s own words

A method for operating an integrated circuit, including: completing a first link equalization operation with an external integrated circuit; receiving a first signal transmitted by an external transmitter included in the external integrated circuit during an operation at an internal receiver included in the integrated circuit; measuring an eye margin of the first signal at the internal receiver; comparing the measured eye phase with a threshold eye margin to obtain and store a comparison result; transmitting the comparison result as a second signal to an external receiver included in the external integrated circuit using an internal transmitter included in the internal integrated circuit; and performing a second link equalization operation between the external transmitter and the external receiver based on the second signal.

What exactly they claim (claim 1)

1. A method of operating an integrated circuit with an external device, the method comprising: receiving a first signal from the external device during an operation of the integrated circuit; measuring an eye margin of the first signal; storing log data for each operating time based on a measuring result; transmitting a second signal to the external device during the operation; receiving a Get Log Page command in response to the second signal; transmitting the log data corresponding to the Get Log Page command; and performing a link equalization operation based on the log data.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
INTEGRATED CIRCUIT FOR PERFORMING LINK EQUALIZATION
Publication number
US20260280944A1
Application number
19679175
Filed
May 15, 2026
Published
Sep 17, 2026
Inventors
4
Claims
20

Classified under

H04L 25/03878 Electricity & electronicsH04B 10/0775 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.