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Samsung patents stacked antenna boards for denser 5G signals

Samsung describes a design where multiple antenna boards are stacked on top of each other to fit more signal receivers into a small space. The boards are attached to a central circuit board, with their signal-sending sides facing outward in the same direction to maximize coverage.

Why it mattersThis layout allows carriers to pack more antennas into existing cell towers, potentially improving data speeds and connection stability in crowded areas.

In the filing’s own words

An apparatus includes transmit receive point (TRP) antenna boards layered such that a front of each respective TRP antenna board faces the same direction. The apparatus includes at least one printed circuit board (PCB) including multiple antenna-facing sides on which the TRP antenna boards are attached, respectively. The apparatus includes front-end circuits that are attached to the at least one PCB and that are electrically coupled to the TRP antenna boards, respectively. Each of the TRP antenna boards includes a rear that is opposite to the front, a signal-propagation side, and a second side. The signal-propagation side includes a two-dimensional (2D) multiple-input multiple-output (MIMO) antenna array and extends from the front to the rear. The second side faces toward the at least one PCB, is opposite to the signal-propagation side, and extends from the front to the rear.

What exactly they claim (claim 1)

1. An apparatus comprising: transmit receive point (TRP) antenna boards layered such that a front of each respective TRP antenna board faces the same direction; at least one printed circuit board (PCB) including multiple antenna-facing sides on which the TRP antenna boards are attached, respectively; and front-end circuits that are attached to the at least one PCB and that are electrically coupled to the TRP antenna boards, respectively, wherein each of the TRP antenna boards includes: a rear that is opposite to the front, a signal-propagation side that includes a two-dimensional (2D) multiple-input multiple-output (MIMO) antenna array and extends from the front to the rear, and a second side that faces toward the at least one PCB, is opposite to the signal-propagation side, and extends from the front to the rear.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
DENSIFIED MULTI-DIMENSIONAL MASSIVE MIMO UNIT
Publication number
US20260280142A1
Application number
19078082
Filed
Mar 12, 2025
Published
Sep 17, 2026
Inventors
4
Claims
20

Classified under

H01Q 21/061 Electricity & electronicsH01Q 1/1242 Electricity & electronicsH01Q 1/1264 Electricity & electronicsH01Q 1/246 Electricity & electronicsH01Q 23/00 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.