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GooglePatent applicationChips & hardwareInterest 6/10

Google patents 3D memory stack with built-in liquid cooling and light links

Google describes a method for stacking high-bandwidth memory chips vertically with an optical connector on top to send data using light instead of electricity. To keep these dense components from overheating, the design includes a specific cooling layer between the memory and the optical part that circulates liquid coolant through internal channels.

Why it mattersThis approach could help data centers handle more data with less heat, which is a major challenge for modern computing power.

In the filing’s own words

The technology generally relates to high bandwidth memory (HBM) and optical connectivity stacking. Disclosed systems and methods herein allow for 3D-stacking of HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An optical chiplet can be configured to be placed onto a stack of HBM dies, with a cooling die that is positioned between the HBM dies and the optical chiplet. The optical chiplet may be configured to connect the HBM optics module package to one or more other components of the package via to one or more optical fibers.

What exactly they claim (claim 1)

1. A method of cooling a stacked die package, the method comprising: determining a temperature of one or more components of the stacked die package, wherein the stacked package includes a cooling die with an inlet and an outlet; determining whether the temperature of the one or more components is within a predetermined threshold; in response to determining the temperature is not within the predetermined threshold, altering a flow of a coolant at the inlet of the cooling die; traversing the coolant through one or more channels in the cooling die; and removing the coolant from the cooling die at the outlet.

Facts

Company
Google (Google LLC)
Official title
3D High Bandwidth Memory and Optical Connectivity Stacking
Publication number
US20260276921A1
Application number
19670247
Filed
May 7, 2026
Published
Sep 17, 2026
Inventors
9
Claims
20

Classified under

G02B 6/4268 Physics & computingG02B 6/4257 Physics & computingG02B 6/4274 Physics & computingH10W 40/22 Electricity & electronicsH10W 40/47 Electricity & electronicsH10W 90/00 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.