Samsung patents chip stack design that protects tiny lenses for light data
Samsung describes a semiconductor package that stacks an electronic chip on top of a photonic chip, which uses light to move data. The design includes a small lens built into a block next to the electronic chip to guide light signals, with a protective cover and a middle layer to shield the lens from damage.
In the filing’s own words
A photonic chip structure includes a photonic integrated circuit chip, an electronic integrated circuit chip on the photonic integrated circuit chip, an optical block on the photonic integrated circuit chip, the optical block being spaced apart from the electronic integrated circuit chip in a horizontal direction and having a microlens integrally formed with the optical block that provides a path for optical signals to reach the photonic integrated circuit chip, a protective block on the optical block, the protective block extending in a direction perpendicular to an upper surface of the optical block to protect the microlens, and an intermediate layer between the optical block and the protective block.
What exactly they claim (claim 1)
1. A photonic chip structure comprising: a photonic integrated circuit chip; an electronic integrated circuit chip on the photonic integrated circuit chip; an optical block on the photonic integrated circuit chip, the optical block being spaced apart from the electronic integrated circuit chip in a horizontal direction and having a microlens integrally formed with the optical block that provides a path for optical signals to reach the photonic integrated circuit chip; a protective block on the optical block, the protective block extending in a direction perpendicular to an upper surface of the optical block to protect the microlens; and an intermediate layer between the optical block and the protective block.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- PHOTONIC CHIP STRUCTURE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number
- US20260276910A1
- Application number
- 19339805
- Filed
- Sep 25, 2025
- Published
- Sep 17, 2026
- Inventors
- 2
- Claims
- 20
Classified under
G02B 6/4214 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.