Samsung patents chip package that mixes light and electricity
Samsung has filed a patent for a computer chip design that combines standard processing units with optical engines on a single base. These optical engines use a special coupler to turn light signals into electrical signals, allowing data to move between the light-based components and the main processors.
In the filing’s own words
Disclosed herein are methods, devices and systems including a substrate supporting one or more processing units and one or more optical engines, the substrate coupling the one or more processing units and the one or more optical engines. The one or more optical engines include a first near compute device and a first bi-directional optical coupler, and the one or more optical engines may convert an incoming optical signal received by the first bi-directional optical coupler to an electrical signal, and the one or more optical engines may route the electrical signal to the first near compute device or the one or more processing units via the one or more optical engines
What exactly they claim (claim 1)
1. A device comprising: a substrate supporting one or more processing units and one or more optical engines; the substrate coupling the one or more processing units and the one or more optical engines; the one or more optical engines including a first near compute device and a first bi-directional optical coupler; the one or more optical engines being configured to convert an incoming optical signal received by the first bi-directional optical coupler to an electrical signal; and the one or more optical engines being configured to route the electrical signal to the first near compute device or the one or more processing units via the one or more optical engines.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SYSTEM AND METHODS FOR MULTI-DEVICE PHOTONIC PACKAGE
- Publication number
- US20260276887A1
- Application number
- 19315467
- Filed
- Aug 29, 2025
- Published
- Sep 17, 2026
- Inventors
- 1
- Claims
- 20
Classified under
G02B 6/12004 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.