Samsung patents fridge cooling system using heat-moving chips
Samsung describes a refrigerator design that uses a thermoelectric module, a device that moves heat from one side to another using electricity, to cool the storage compartment. The module is attached to the top of the fridge with a fastening member and support ribs, while a duct helps release the heat generated on the other side.
In the filing’s own words
A refrigerator is provided. The refrigerator includes a main body, a storage compartment formed inside the main body, a thermoelectric module assembly including a thermoelectric element including a heat generating portion and a heat absorbing portion, a heat dissipating sink in contact with the heat generating portion, a cooling sink in contact with the heat absorbing portion, and a dissipating duct configured to dissipate heat from the heat dissipating sink, the thermoelectric module assembly being coupled to an upper portion of the main body to cool the storage compartment, and a fastening member configured to pass through the thermoelectric module assembly to be coupled to the upper portion of the main body, the fastening member coupling the thermoelectric module assembly to the upper portion of the upper portion of the main body, wherein the thermoelectric module assembly further includes at least one support rib protruding downwardly.
What exactly they claim (claim 1)
1. A refrigerator, comprising: a main body; a storage compartment formed inside the main body; a thermoelectric module assembly comprising: a thermoelectric element comprising a heat generating portion and a heat absorbing portion, a heat dissipating sink in contact with the heat generating portion, a cooling sink in contact with the heat absorbing portion, and a dissipating duct configured to dissipate heat from the heat dissipating sink, the thermoelectric module assembly being coupled to an upper portion of the main body to cool the storage compartment; and a fastening member configured to pass through the thermoelectric module assembly to be coupled to the upper portion of the main body to couple the thermoelectric module assembly to the upper portion of the main body, wherein the thermoelectric module assembly further comprises at least one support rib protruding downwardly to be supported on the upper portion of the main body at a position other than a position at which the fastening member is coupled.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- REFRIGERATOR
- Publication number
- US20260276294A1
- Application number
- 19669364
- Filed
- May 6, 2026
- Published
- Sep 17, 2026
- Inventors
- 4
- Claims
- 15
Classified under
F25D 23/028 Mechanical engineeringE05D 11/0054 Buildings & constructionF25D 15/00 Mechanical engineeringF25D 19/00 Mechanical engineeringMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.