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Samsung patents fridge cooling plate that radiates heat away

Samsung has filed a patent for a cooling component used in refrigerators that uses a special coating to shed heat. The coating is made of tiny oxide particles wrapped in a polymer that helps release heat into the air without needing a fan.

Why it mattersThis could make small cooling systems in appliances more efficient by passively releasing heat, though it is a specific technical improvement rather than a new product type.

In the filing’s own words

A thermoelectric module includes: a first heat dissipation plate; a second heat dissipation plate, wherein the first heat dissipation plate and the second heat dissipation plate face opposite directions; and a Peltier element interposed between and contacting the first heat dissipation plate and the second heat dissipation plate, wherein each of the first heat dissipation plate and the second heat dissipation plate includes a thermal radiation coating layer formed on a surface thereof for radiation cooling, wherein the thermal radiation coating layer includes: oxide particles, and a thermal radiation material comprising a high-emissivity polymer compound, wherein the thermal radiation material surrounds the oxide particles through self-assembly.

What exactly they claim (claim 1)

1. A thermoelectric module comprising: a first heat dissipation plate; a second heat dissipation plate, wherein the first heat dissipation plate and the second heat dissipation plate face opposite directions; and a Peltier element interposed between and contacting the first heat dissipation plate and the second heat dissipation plate, wherein each of the first heat dissipation plate and the second heat dissipation plate comprises a thermal radiation coating layer formed on a surface thereof for radiation cooling, wherein the thermal radiation coating layer comprises: oxide particles, and a thermal radiation material comprising a high-emissivity polymer compound, wherein the thermal radiation material surrounds the oxide particles through self-assembly.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
THERMOELECTRIC MODULE AND REFRIGERATOR INCLUDING SAME
Publication number
US20260276262A1
Application number
19676383
Filed
May 13, 2026
Published
Sep 17, 2026
Inventors
4
Claims
15

Classified under

F25B 21/02 Mechanical engineering
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.