Samsung patents fridge design that tucks temperature sensor into heat sink
Samsung describes a refrigerator that uses a thermoelectric element to cool the interior, which requires a heat sink to dissipate waste heat. The design includes a specific groove in the heat sink base to securely hold a temperature sensor in place.
In the filing’s own words
A refrigerator includes a storage compartment formed inside a main body, a thermoelectric element configured to cool the storage compartment, a heat sink in contact with the thermoelectric element, the heat sink including a sink base and a plurality of fins protruding from one surface of the sink base, and a temperature sensor configured to measure a temperature of the heat sink, the temperature sensor including a sensor member and a wire. The heat sink includes a sensor receiving groove recessed in the one surface of the sink base, and the sensor member is received in the sensor receiving groove.
What exactly they claim (claim 1)
1. A refrigerator comprising: a main body; a storage compartment formed inside the main body; a thermoelectric element configured to cool the storage compartment; a heat sink in contact with the thermoelectric element, the heat sink comprising: a sink base; and a plurality of fins protruding from one surface of the sink base; a temperature sensor configured to measure a temperature of the heat sink, the temperature sensor comprising: a sensor member; and a wire connected to the sensor member; and a sensor fastening member coupled to the heat sink by penetrating the sensor member to fix the sensor member, wherein the heat sink comprises a sensor receiving groove recessed in the one surface of the sink base, and wherein the sensor member is received in the sensor receiving groove.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- REFRIGERATOR
- Publication number
- US20260276261A1
- Application number
- 19671725
- Filed
- May 8, 2026
- Published
- Sep 17, 2026
- Inventors
- 5
- Claims
- 20
Classified under
F25B 21/02 Mechanical engineeringF25B 2321/025 Mechanical engineeringF25B 2700/21 Mechanical engineeringMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.