Samsung patents chip-making tube with split gas nozzles
Samsung describes a machine part used to make computer chips, featuring a long tube with two separate nozzles inside. These nozzles spray different gases into specific gaps to control how the chip layers form.
In the filing’s own words
A device for manufacturing a semiconductor device is provided. The device for manufacturing a semiconductor device includes a tube extending in a first direction, and defining a reaction space therein and configured to accommodate a boat that is configured to receive a plurality of substrates therein, and first and second nozzles each extending in the first direction inside the tube, and being apart from each other on a plane that is perpendicular to the first direction and parallel to upper surfaces of the substrates, wherein the first and second nozzles include a plurality of first injection ports and a plurality of first second injection ports that are configured inject different gases toward a center of the reaction space, respectively, and a plurality of second injection ports are placed in a region between a corresponding pair of adjacent ones of the plurality of first injection ports along the first direction.
What exactly they claim (claim 1)
1. A device for manufacturing a semiconductor device comprising: a tube extending in a first direction, the tube including a reaction space therein and configured to accommodate a boat that is configured to receive a plurality of substrates therein; and first and second nozzles each extending in the first direction inside the tube, the first and second nozzles being apart from each other on a horizontal plane perpendicular to the first direction and parallel to upper surfaces of the substrates, wherein the first nozzle includes a plurality of first injection ports that are configured to inject a plurality of first gas layers to divide the reaction space into a plurality of regions along the first direction, and the second nozzle includes a second injection port that is configured to inject a second gas layer into a region between a corresponding adjacent pair of the plurality of first gas layers.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- DEVICE FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
- Publication number
- US20260275523A1
- Application number
- 19672268
- Filed
- May 8, 2026
- Published
- Sep 17, 2026
- Inventors
- 3
- Claims
- 20
Classified under
C23C 16/45578 Chemistry & metalsC23C 16/45544 Chemistry & metalsC23C 16/45546 Chemistry & metalsC23C 16/45574 Chemistry & metalsC23C 16/52 Chemistry & metalsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.