Samsung patents chemical mix for making finer chip patterns
Samsung has filed a patent for a liquid mixture designed to create a protective layer on semiconductor wafers. The composition uses specific chemical compounds to help form extremely small patterns during the manufacturing of computer chips.
In the filing’s own words
Provided are a composition including a solvent and a protection layer-forming material, a method of preparing a fine pattern by using the same, and a method of manufacturing a semiconductor device by using the same. The protection layer-forming material may include a compound represented by Formula 1 below: For descriptions of Formula 1, refer to the specification.
What exactly they claim (claim 1)
1. A composition comprising: a solvent; and a protection layer-forming material, wherein the protection layer-forming material comprises a compound represented by Formula 1 below, wherein in Formula 1, X 1 and X 2 are each independently O or S, R 1 and R 2 are each independently a C 1 -C 30 alkyl group, a C 2 -C 30 alkenyl group, a C 3 -C 10 cycloalkyl group, a C 2 -C 10 heterocycloalkyl group, a C 6 -C 30 aryl group, or a C 2 -C 30 heteroaryl group, wherein, in R 1 and R 2, at least one hydrogen is optionally substituted with a halogen atom, a C 1 -C 30 alkyl group, *—O(Q 1), *—NH 2, *—NH(Q 1), or *—N(Q 1)(Q 2), wherein Q 1 and Q 2 are each independently a C 1 -C 30 alkyl group, or a C 6 -C 30 aryl group, wherein, in Q 1 and Q 2, at least one hydrogen is optionally substituted with a halogen atom, a C 1 -C 30 alkyl group, a C 1 -C 30 alkoxy group, an amino group, a (C 1 -C 10 alkyl)amino group, or a di(C 1 -C 10 alkyl)amino group, and * is a bonding site with a neighboring atom.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- COMPOSITION, METHOD OF PREPARING FINE PATTERN BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
- Publication number
- US20260275125A1
- Application number
- 19441161
- Filed
- Jan 6, 2026
- Published
- Sep 17, 2026
- Inventors
- 9
- Claims
- 20
Classified under
C09D 5/24 Chemistry & metalsC09D 7/20 Chemistry & metalsH10W 20/056 Electricity & electronicsH10W 20/0765 Electricity & electronicsH10W 20/42 Electricity & electronicsH10W 20/4405 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.