Samsung patents chip cleaning tool that washes its own moving parts
Samsung has filed a patent for a machine used to make computer chips that cleans the robotic arm while it is working. The system sprays cleaning fluid onto the arm and the chip holder at the same time to remove dirt. This keeps the equipment clean without stopping the production process.
In the filing’s own words
An apparatus for manufacturing a semiconductor device, including: a wet treatment chamber; a nozzle provided in the wet treatment chamber and configured to spray a treatment material onto a substrate; a supercritical fluid treatment chamber configured to supply a supercritical fluid onto the substrate to treat the substrate; a transfer device comprising an arm configured to transfer the substrate between the wet treatment chamber and the supercritical fluid treatment chamber; and a controller configured to control the wet treatment chamber to spray the treatment material onto the arm.
What exactly they claim (claim 1)
1. A method of manufacturing a semiconductor device using an apparatus for manufacturing the semiconductor device, the method comprising: placing an arm of a transfer device included in the apparatus into a wet treatment chamber included in the apparatus, wherein the arm is configured to transfer a substrate between the wet treatment chamber and a supercritical fluid treatment chamber included in the apparatus, and wherein the wet treatment chamber includes a support configured to support the substrate, a first nozzle, and a second nozzle; and simultaneously spraying a treatment material onto the arm and the support using at least one of the first nozzle and the second nozzle.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
- Publication number
- US20260273587A1
- Application number
- 19676515
- Filed
- May 13, 2026
- Published
- Sep 17, 2026
- Inventors
- 7
- Claims
- 20
Classified under
B08B 3/02 Operations & transportB08B 3/08 Operations & transportB08B 5/02 Operations & transportB08B 13/00 Operations & transportH10P 72/7602 Electricity & electronicsF26B 5/005 Mechanical engineeringMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.