Samsung patents stacked memory chip design with exposed trench isolation
Samsung describes a semiconductor device where a memory cell structure sits beneath a peripheral circuit structure. The peripheral circuit includes a substrate with doped regions, transistors, and a trench isolation layer that is exposed by a passivation layer.
In the filing’s own words
A semiconductor device includes a memory cell structure and a peripheral circuit structure arranged on the memory cell structure. The peripheral circuit structure includes a first substrate including at least one substrate region doped with impurities, a peripheral circuit transistor arranged on the at least one substrate region, a peripheral circuit wire layer electrically connected to the peripheral circuit transistor, a passivation layer arranged on the at least one substrate region, and a trench isolation layer penetrating the at least one substrate region, and the passivation layer exposes the trench isolation layer.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a memory cell structure; and a peripheral circuit structure on the memory cell structure, wherein the peripheral circuit structure comprises a first substrate comprising at least one substrate region doped with impurities, a peripheral circuit transistor on the at least one substrate region, a peripheral circuit wire layer electrically connected to the peripheral circuit transistor, a passivation layer on the at least one substrate region, and a trench isolation layer extending into the at least one substrate region, and wherein the passivation layer exposes the trench isolation layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number
- US20260271798A1
- Application number
- 19551802
- Filed
- Feb 27, 2026
- Published
- Sep 10, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10W 90/297 Electricity & electronicsH10B 80/00 Electricity & electronicsH10D 80/30 Electricity & electronicsH10W 20/2134 Electricity & electronicsH10W 20/435 Electricity & electronicsH10W 74/137 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.