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Google patents chip design that hides voltage regulator inside heatsink

Google describes a way to fit a voltage regulator directly inside the hollow space of a chip's heatsink. This setup uses small spring-loaded pins to pass power from the regulator down to the chip below.

Why it mattersThis design could help manage heat and power more efficiently in high-performance computer chips.

In the filing’s own words

A voltage regulator assembly for an integrated circuit package includes a heatsink positioned above an upper surface of an integrated circuit package. The heatsink defines a cavity above the integrated circuit package and a voltage regulator is positioned inside the cavity defined by the heatsink. A pogo pin pad is positioned between the voltage regulator and integrated circuit package and is configured to transfer a voltage from the voltage regulator to the integrated circuit package. Also provided is a method of regulating voltage for an integrated circuit package using such a voltage regulator assembly.

What exactly they claim (claim 1)

1. A voltage regulator assembly for an integrated circuit package, comprising: a heatsink positioned above an upper surface of an integrated circuit package, the heatsink defining a cavity above the integrated circuit package; a voltage regulator positioned inside the cavity defined by the heatsink; and a pogo pin pad positioned between the voltage regulator and the integrated circuit package, the pogo pin pad being configured to transfer a voltage from the voltage regulator to the integrated circuit package.

Facts

Company
Google (Google LLC)
Official title
HEATSINK INTEGRATED VOLTAGE REGULATOR ASSEMBLY FOR AN INTEGRATED CIRCUIT PACKAGE
Publication number
US20260271706A1
Application number
19069958
Filed
Mar 4, 2025
Published
Sep 10, 2026
Inventors
1
Claims
20

Classified under

H10W 40/00 Electricity & electronicsH10W 72/50 Electricity & electronicsH10W 90/736 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.