Samsung patents chip design with vertical metal connections
Samsung describes a method for building a semiconductor chip that uses a metal wire running straight through the silicon base. The process involves adding layers of insulating material and metal to create a specific connection point on the chip's surface.
In the filing’s own words
A method of manufacturing a semiconductor chip includes forming a through electrode penetrating a semiconductor substrate, forming a first insulating layer on the semiconductor substrate, the first insulating layer having a first opening exposing the through electrode, forming a first seed metal layer on a bottom surface and a side surface of the first opening, forming a first core metal layer in the first opening to cover the first seed metal layer, forming a second insulating layer on an outer portion of an upper surface of the first core metal layer, the second insulating layer having a second opening exposing a central portion of the upper surface of the first core metal layer, and forming a second conductive pad on the central portion of the upper surface of the first core metal layer and in the second opening.
What exactly they claim (claim 1)
1. A method of manufacturing a semiconductor chip, the method comprising: forming a through electrode penetrating a semiconductor substrate; forming a first insulating layer on the semiconductor substrate, the first insulating layer having a first opening exposing the through electrode; forming a first seed metal layer on a bottom surface and a side surface of the first opening; forming a first core metal layer in the first opening to cover the first seed metal layer; forming a second insulating layer on an outer portion of an upper surface of the first core metal layer, the second insulating layer having a second opening exposing a central portion of the upper surface of the first core metal layer; and forming a second conductive pad on the central portion of the upper surface of the first core metal layer and in the second opening.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number
- US20260271640A1
- Application number
- 19555381
- Filed
- Mar 3, 2026
- Published
- Sep 10, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10P 14/69433 Electricity & electronicsH10P 14/69215 Electricity & electronicsH10W 20/023 Electricity & electronicsH10W 20/069 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/792 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.