Samsung patents new layout for semiconductor chips with stacked connections
Samsung has filed a patent application for a semiconductor device design that arranges electrical components in a specific horizontal and vertical structure. The design uses a series of vertical connections, or vias, to link different parts of the chip, such as the gate and source/drain regions, through insulating layers.
In the filing’s own words
A semiconductor device includes a first pattern extending in a first horizontal direction, a second pattern extending in the first horizontal direction, a field insulating layer between the first pattern and the second pattern, a gate electrode that extends in a second horizontal direction on the first pattern, the second pattern and the field insulating layer, a first source/drain region on the first pattern, a second source/drain region on the second pattern, a first source/drain contact on the first source/drain region, an upper interlayer insulating layer on the field insulating layer, a first through via between the first source/drain region and the second source/drain region and connected to the first source/drain contact, a second through via between the first pattern and the second pattern and connected to the first through via, and a third through via on a bottom surface of the second through via.
What exactly they claim (claim 1)
1 - 20. (canceled)
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- SEMICONDUCTOR DEVICES
- Publication number
- US20260271366A1
- Application number
- 19664841
- Filed
- Apr 30, 2026
- Published
- Sep 10, 2026
- Inventors
- 4
- Claims
- 21
Classified under
H10D 64/251 Electricity & electronicsH10D 84/83 Electricity & electronicsH10W 20/20 Electricity & electronicsH10W 20/42 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.