Samsung patents chip layer that stops heat damage during manufacturing
Samsung describes a method for making electronic components that uses a special barrier layer to control how materials harden. This barrier stops the hardening process from spreading to the base material, which helps keep the chip's structure stable during heating.
In the filing’s own words
Provided are an electronic device and a method of manufacturing the same. The electronic device includes a ferroelectric crystallization layer between a substrate and a gate electrode and a crystallization prevention layer between the substrate and the ferroelectric crystallization layer. The ferroelectric crystallization layer is at least partially crystallized and includes a dielectric material having ferroelectricity or anti-ferroelectricity. Also, the crystallization prevention layer prevents crystallization in the ferroelectric crystallization layer from being spread toward the substrate.
What exactly they claim (claim 1)
1. A method of manufacturing an electronic device, the method comprising: preparing a substrate on which a channel element is provided; forming, on the substrate, a crystallization prevention layer that includes an amorphous dielectric material; forming an amorphous dielectric material layer on the crystallization prevention layer; forming a gate electrode on the amorphous dielectric material layer; and forming a ferroelectric crystallization layer having ferroelectricity or anti-ferroelectricity by crystallizing at least a portion of the amorphous dielectric material layer through an annealing process, the crystallization prevention layer being configured to prevent crystallization in the ferroelectric crystallization layer from spreading toward the substrate.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number
- US20260271345A1
- Application number
- 19009608
- Filed
- Jan 3, 2025
- Published
- Sep 10, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10D 30/701 Electricity & electronicsH10D 64/01 Electricity & electronicsH10D 64/689 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.