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Samsung patents oxide semiconductor layer with barrier to improve device stability

Samsung describes a semiconductor structure that uses an oxide material for its main layer, sandwiched between electrodes and a gate. It adds a specific barrier layer between the oxide and an insulating layer to prevent unwanted chemical reactions during manufacturing.

Why it mattersThis is a routine improvement in chip manufacturing that aims to make oxide-based transistors more reliable by controlling how materials interact during production.

In the filing’s own words

Provided are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes an oxide semiconductor layer, a first electrode and a second electrode which are arranged apart from each other on the oxide semiconductor layer, a gate electrode arranged apart from the oxide semiconductor layer, a gate insulating layer arranged between the oxide semiconductor layer and the gate electrode, an insulating layer arranged on a surface of the oxide semiconductor layer, wherein the surface is not in contact with the first electrode, the second electrode, and the gate insulating layer, and a barrier layer arranged between the oxide semiconductor layer and the insulating layer.

What exactly they claim (claim 1)

1. A semiconductor device comprising: an oxide semiconductor layer; a first electrode and a second electrode spaced apart from each other on the oxide semiconductor layer; a gate electrode spaced apart from the oxide semiconductor layer; a gate insulating layer between the oxide semiconductor layer and the gate electrode; an insulating layer facing a surface of the oxide semiconductor layer, the surface of the oxide semiconductor layer not in contact with the first electrode, the second electrode, and the gate insulating layer; and a barrier layer between the oxide semiconductor layer and the insulating layer, and including a third element, an oxide formation energy of the third element is less than an oxide formation energy of a first element included in the oxide semiconductor layer and less than an oxide formation energy of a second element included in the insulating layer.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
US20260271337A1
Application number
19371917
Filed
Oct 28, 2025
Published
Sep 10, 2026
Inventors
5
Claims
20

Classified under

H10D 30/6706 Electricity & electronicsH10B 12/30 Electricity & electronicsH10D 30/027 Electricity & electronicsH10D 30/6755 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.