/Patent Tracker
SamsungPatent applicationChips & hardwareInterest 3/10

Samsung patents chip design using two metals in transistor layers

Samsung has filed a patent for a semiconductor device that uses a specific arrangement of metals within the transistors on a chip. The design places a layer containing two different types of metal between the insulating layer and the gate electrode of the transistor.

Why it mattersThis is a routine improvement to chip manufacturing that could help make transistors more efficient or reliable, though it does not describe a new consumer feature.

In the filing’s own words

A semiconductor device according to embodiments includes a substrate, and a plurality of transistors on or at the substrate. The plurality of transistors include a first conductivity type transistor. The first conductivity type transistor includes a gate insulation layer, a first intermediate layer, and a gate electrode sequentially on the substrate. The first intermediate layer includes a first region including a first metal on the gate insulation layer and a second region spaced apart from the gate insulation layer on the first region. The second region includes the first metal, and a second metal different from the first metal.

What exactly they claim (claim 1)

1. A semiconductor device, comprising: a substrate; and a plurality of transistors on or at the substrate, wherein the plurality of transistors include a first conductivity type transistor, wherein the first conductivity type transistor includes a gate insulation layer, a first intermediate layer, and a gate electrode sequentially on the substrate, wherein the first intermediate layer includes a first region including a first metal on the gate insulation layer and a second region spaced apart from the gate insulation layer on the first region, and wherein the second region includes the first metal, and a second metal different from the first metal.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
Publication number
US20260271298A1
Application number
19330026
Filed
Sep 16, 2025
Published
Sep 10, 2026
Inventors
3
Claims
20

Classified under

H10B 43/40 Electricity & electronicsH10B 41/27 Electricity & electronicsH10B 41/35 Electricity & electronicsH10B 41/41 Electricity & electronicsH10B 43/27 Electricity & electronicsH10B 43/35 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Samsung in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.