Samsung patents method to adapt chip layouts for different manufacturing processes
This filing describes a software method that helps engineers adjust the physical layout of a computer chip when moving it to a new manufacturing process. The system takes an existing chip design, analyzes its structure, and calculates how to reshape the layout and place connection points to fit the requirements of the new process.
In the filing’s own words
The method is performed by the computing system and includes extracting first process information and first floorplan information from a first floorplan of a first process, receiving second process information of a second process, determining a shape and a size of a second floorplan based on the first process information, the first floorplan information and the second process information, determining locations of ports and a location of a blockage area in the second floorplan, and generating second floorplan information of the second floorplan based on the shape and the size of the second floorplan, and the locations of the ports and the location of the blockage area in the second floorplan.
What exactly they claim (claim 1)
1. A method of designing an integrated circuit performed by a computing system, the method comprising: extracting first process information and first floorplan information from a first floorplan of a first process; receiving second process information of a second process; determining a shape and a size of a second floorplan based on the first process information, the first floorplan information and the second process information; determining locations of ports and a location of a blockage area in the second floorplan; and generating second floorplan information of the second floorplan based on the shape and the size of the second floorplan, and the locations of the ports and the location of the blockage area in the second floorplan.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- METHOD AND COMPUTING SYSTEM FOR DESIGNING INTEGRATED CIRCUIT
- Publication number
- US20260268058A1
- Application number
- 19553978
- Filed
- Mar 2, 2026
- Published
- Sep 10, 2026
- Inventors
- 1
- Claims
- 20
Classified under
G06F 30/392 Physics & computingMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.