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Samsung patents ultrasonic method to check chip layers for defects

Samsung describes a system that uses sound waves to inspect semiconductor chips for flaws. The method simulates how sound travels through specific chip structures to choose the right probe and frequency, then compares the actual sound readings to the simulation to verify accuracy.

Why it mattersThis improves the quality control process for making computer chips by using sound waves to detect tiny structural errors before the devices are finished.

In the filing’s own words

Provided is a method of inspecting semiconductor devices, the method including selecting a type of a target structure and a type of a target defect to be inspected, selecting a filter based on the target structure and the target defect, performing an ultrasonic signal simulation based on the target structure, selecting, based on the ultrasonic signal simulation, a type of a probe configured to generate an ultrasonic signal by applying a vibration to the semiconductor device, setting a frequency of the vibration based on the ultrasonic signal simulation, generating the ultrasonic signal by applying, using the tip, the vibration to the semiconductor device, measuring the ultrasonic signal, processing the measured ultrasonic signal using the selected filter, performing a fitting for each of a signal generated by the ultrasonic signal simulation and the measured ultrasonic signal processed by the selected filter, and determining an accuracy of the fitting.

What exactly they claim (claim 1)

1. A method of inspecting semiconductor devices, the method comprising: selecting a type of a target structure and a type of a target defect based on a semiconductor device comprising at least one layer; selecting a filter based on the target structure and the target defect; performing an ultrasonic signal simulation based on the target structure; selecting, based on the ultrasonic signal simulation, a type of a probe configured to generate an ultrasonic signal by applying a vibration to the semiconductor device; setting a frequency of the vibration based on the ultrasonic signal simulation; generating the ultrasonic signal by applying, using the tip, the vibration to the semiconductor device; measuring the ultrasonic signal; processing the measured ultrasonic signal using the selected filter; performing a fitting for each of a signal generated by the ultrasonic signal simulation and the measured ultrasonic signal processed by the selected filter; and determining an accuracy of the fitting.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SYSTEM FOR AND METHOD OF INSPECTING SEMICONDUCTOR DEVICES, AND METHOD OF MANUFACTURING THE DEVICES INCLUDING THE METHOD
Publication number
US20260266773A1
Application number
19560809
Filed
Mar 9, 2026
Published
Sep 10, 2026
Inventors
13
Claims
20

Classified under

G01N 29/4445 Physics & computingG01N 29/24 Physics & computingG01N 29/343 Physics & computingG01N 29/4436 Physics & computingG01N 29/46 Physics & computing
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.