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Samsung patents capacitor layers to boost chip reliability

Samsung describes a semiconductor capacitor design using specific oxide layers with distinct crystal structures between its electrodes. The filing details a stack of films, including a rutile-structured layer and a tetragonal dielectric, to improve electrical performance and stability.

Why it mattersThis is a routine improvement in chip manufacturing that aims to make the tiny capacitors inside processors more reliable over time.

In the filing’s own words

There is provided a semiconductor device having improved electrical characteristics and reliability. The semiconductor device includes an upper electrode, a lower electrode including a first metal element, a lower inserted electrode film disposed between the upper electrode and the lower electrode, a lower interfacial electrode film disposed between the lower inserted electrode film and the upper electrode, and a capacitor dielectric film disposed between the lower interfacial electrode film and the upper electrode. The lower inserted electrode film has a rutile structure and includes an oxide of the lower electrode, the lower interfacial electrode film has a rutile structure and includes a second metal element different from the first metal element and an oxide of the second metal element, and the capacitor dielectric film has a tetragonal crystal system and includes an oxide of a third metal element different from the second metal element.

What exactly they claim (claim 1)

1. A semiconductor device comprising: an upper electrode; a lower electrode including a first metal element; a lower inserted electrode film disposed between the upper electrode and the lower electrode, wherein the lower inserted electrode film has a rutile structure, and includes an oxide of the lower electrode; a lower interfacial electrode film disposed between the lower inserted electrode film and the upper electrode, wherein the lower interfacial electrode film has a rutile structure, and includes a second metal element different from the first metal element and an oxide of the second metal element; and a capacitor dielectric film disposed between the lower interfacial electrode film and the upper electrode, wherein the capacitor dielectric film has a tetragonal crystal system, and includes a third metal element different from the second metal element and an oxide of the third metal element.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
US20260262215A1
Application number
19379181
Filed
Nov 4, 2025
Published
Sep 3, 2026
Inventors
7
Claims
20

Classified under

H10B 12/315 Electricity & electronicsH10B 12/033 Electricity & electronics

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.