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Microsoft patents heat sink with 3D fluid paths for better cooling

Microsoft has filed a patent for a heat sink design made of individual cells placed next to each other. Each cell contains fins that guide cooling fluid through a three-dimensional path to remove heat from electronic components.

Why it mattersThis design aims to improve how heat is removed from computer parts, which is a standard engineering challenge for keeping devices running smoothly.

In the filing’s own words

A device may include a plurality of dissociated unitary cells adjacent to one another. A dissociated unitary cell may include a base supporting a body having at least one sidewall. A dissociated unitary cell may include a top surface. A dissociated unitary cell may include a plurality of fins to direct a cooling fluid through the body in a three-dimensional flow path through the plurality of dissociated unitary cells.

What exactly they claim (claim 1)

1. A heat sink comprising: a plurality of dissociated unitary cells adjacent to one another, wherein each of the dissociated unitary cells includes: a base supporting a body having at least one sidewall, a top surface, and a plurality of fins to direct a cooling fluid through the body in a three-dimensional flow path through the plurality of dissociated unitary cells.

Facts

Company
Microsoft (Microsoft Technology Licensing, LLC)
Official title
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT
Publication number
US20260262196A1
Application number
19194750
Filed
Apr 30, 2025
Published
Sep 3, 2026
Inventors
4
Claims
20

Classified under

H05K 7/2039 Electricity & electronicsG06F 1/20 Physics & computingH05K 7/20327 Electricity & electronicsH10W 40/226 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.