Samsung patents electrical network design for fast data transfer inside devices
Samsung describes a method for connecting multiple computing units using a specific layout of electrical switches. The system splits data into smaller parts and sends them through separate electrical paths to different switches, which then route the data to the destination unit. This arrangement keeps the physical wiring short, ensuring the electrical signals remain strong over the distance.
In the filing’s own words
A device and method that implements a multi-stage electrical interconnection network is provided. The electronic device includes a plurality of computing devices and a plurality of switches grouped into a plurality of groups. Switches, of the plurality of switches, in a same group are configured to be fully connected to computing devices in the same group, each of switches of the plurality of switches included in a first group among the plurality of groups is configured to have a ono-to-one connection with any one of switches included in a second group, and a connection between the computing devices in the same group and the switches in the same group and a connection between switches in in the plurality of groups are electrical connections.
What exactly they claim (claim 1)
1. A method of a system having a plurality of computing devices and a plurality of switches respectively grouped into a plurality of groups, including first and second groups that each include multiple computing devices and multiple switches, comprising: partitioning data into respective data partitions to be transmitted from a first computing device in the first group to a second computing device in the second group, and transmitting each of the respective data partitions through different lanes of the first computing device to different first switches in the first group using respective electrical connections between each of the different lanes of the first computing device and a respective lane of each of the different first switches; transmitting the respective data partitions to different second switches in the second group using respective electrical connections between the different first switches and the different second switches; and transmitting the respective data partitions from each of the different second switches to the second computing device using respective electrical connections between a respective lane of each of the different second switches and different lanes of the second computing device, wherein each one of the different first switches is configured to have a one-to-one connection with a corresponding one of the different second switches, wherein the computing devices and the switches are arranged in a printed circuit board (PCB) within a predetermined range based on a link budget of an electrical interface, and wherein the predetermined range is a trace length less than 460 millimeters.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- DEVICE AND METHOD WITH MULTI-STAGE ELECTRICAL INTERCONNECTION NETWORK
- Publication number
- US20260261526A1
- Application number
- 19654853
- Filed
- Apr 22, 2026
- Published
- Sep 3, 2026
- Inventors
- 5
- Claims
- 8
Classified under
H04L 49/1515 Electricity & electronicsH04Q 3/52 Electricity & electronicsH04L 5/0001 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.