Microsoft patents superconducting cables that send data via power lines
Microsoft describes a way to send control information through superconducting cables without adding separate data wires. It uses electrical coils to layer data signals on top of the power flow or changes in the cooling fluid's pressure to carry the information.
In the filing’s own words
Technology is disclosed for data transmission over superconducting cables without a dedicated data transmission line. Control data associated with the superconducting cables is transmitted between terminations of the superconducting cable. In some embodiments, inductive coils at the termination may be used to superimpose data at a higher frequency than the electrical power for transmission over the superconductors to other terminations. In other embodiments, changes in parameters of the cryogenic fluid used to cool the superconductors may be used to transmit control data between terminations. For example, pressure changes and/or flow rate changes may be used to encode the control data. In either case, the dedicated transmission line typically accompanying a superconducting cable is not needed.
What exactly they claim (claim 1)
1. A system, comprising: a superconducting cable comprising a plurality of superconductors that transmit electrical power at a first frequency; a termination coupled to a first end of the superconducting cable, wherein the termination comprises: a plurality of joints, wherein each joint couples at least one of the plurality of superconductors to a conductor, and a conductive coil inductively coupled to the plurality of joints; and a processor communicatively coupled to the conductive coil and configured to transmit signals representing control data of one or more parameters of the superconducting cable at a second frequency higher than the first frequency to the conductive coil.
Facts
- Company
- Microsoft (Microsoft Technology Licensing, LLC)
- Official title
- DATA TRANSMISSION THROUGH SUPERCONDUCTING CABLES
- Publication number
- US20260260789A1
- Application number
- 19067265
- Filed
- Feb 28, 2025
- Published
- Sep 3, 2026
- Inventors
- 1
- Claims
- 19
Classified under
H01B 12/16 Electricity & electronicsG01D 21/02 Physics & computingG01K 13/026 Physics & computingG01K 2203/00 Physics & computingMore from Microsoft in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.