Samsung patents chip stack design with built-in heat spreader
Samsung describes a semiconductor package layout where one chip sits directly on top of another, while a separate heat-dissipating component is placed next to them. The design uses a base board to hold the chips and includes vertical tunnels in one chip to help manage heat and connections.
In the filing’s own words
Provided is a semiconductor package including a redistribution substrate, a first semiconductor chip on the redistribution substrate, a second semiconductor chip on the redistribution substrate and spaced apart from the first semiconductor chip in a horizontal direction, a third semiconductor chip on the second semiconductor chip, and a heat dissipation chip on the first semiconductor chip and spaced apart from the third semiconductor chip in the horizontal direction, wherein the second semiconductor chip includes a plurality of through vias passing through at least a portion of the second semiconductor chip in a vertical direction, and wherein a metal pad and an adhesive layer are between the first semiconductor chip and the heat dissipation chip.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a redistribution substrate; a first semiconductor chip on the redistribution substrate; a second semiconductor chip on the redistribution substrate and spaced apart from the first semiconductor chip in a horizontal direction; a third semiconductor chip on the second semiconductor chip; and a heat dissipation chip on the first semiconductor chip and spaced apart from the third semiconductor chip in the horizontal direction, wherein the second semiconductor chip comprises a plurality of through vias passing through at least a portion of the second semiconductor chip in a vertical direction, and wherein a metal pad and an adhesive layer are between the first semiconductor chip and the heat dissipation chip.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package and method of manufacturing the same
- Patent number
- US12772912B2
- Application number
- 18655903
- Filed
- May 6, 2024
- Granted
- Oct 20, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10W 90/00 Electricity & electronicsH10B 80/00 Electricity & electronicsH10W 20/20 Electricity & electronicsH10W 40/22 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/685 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.