Samsung patents chip package with heat-resistant solder bumps
Samsung has been granted a patent for a semiconductor package design that uses special bumps to connect chips to circuit boards. These bumps feature a metal layer containing high-melting-point atoms mixed into the solder to improve durability during manufacturing.
In the filing’s own words
A semiconductor package includes: a first substrate including lower bonding pads; at least one semiconductor chip disposed on the first substrate; bumps disposed on a first surface of the first substrate; and a mold layer disposed on the first substrate and covering the at least one semiconductor chip, wherein the bumps include: a pillar portion bonded to the first surface of the first substrate; a solder portion bonded to a first surface of the pillar portion; and a metal layer including a material including high-melting-point metal atoms, wherein the metal layer covers a first surface of the solder portion, wherein the solder portion includes the high-melting-point metal atoms.
What exactly they claim (claim 1)
1. A semiconductor package, comprising: a first substrate including an upper surface, a lower surface, and lower bonding pads; at least one semiconductor chip disposed on the upper surface of the first substrate; bumps disposed on the lower surface of the first substrate; and a mold layer disposed on the upper surface of the first substrate and covering the at least one semiconductor chip, wherein the bumps comprise: a pillar portion bonded to the lower surface of the first substrate and a solder portion bonded to a lower surface of the pillar portion with respect to the lower surface of the first substrate, wherein the solder portion comprises a solder layer and a metal layer, wherein the metal layer comprises a material including high-melting-point metal atoms, wherein the metal layer covers a first lower surface of the solder layer with respect to the lower surface of the first substrate, and wherein the solder portion comprises the high-melting-point metal atoms.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package
- Patent number
- US12772907B2
- Application number
- 18417004
- Filed
- Jan 19, 2024
- Granted
- Oct 20, 2026
- Inventors
- 2
- Claims
- 20
Classified under
H10W 90/00 Electricity & electronicsH10W 74/117 Electricity & electronicsH10W 90/701 Electricity & electronicsH10W 74/00 Electricity & electronicsH10W 90/723 Electricity & electronicsH10W 90/724 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.