/Patent Tracker
SamsungGranted patentChips & hardwareInterest 6/10

Samsung patents chip cooling using two sizes of metal particles

Patent drawing
Patent drawing from the official filing.

Samsung has been granted a patent for a semiconductor package that uses a specific mix of metal particles to move heat away from a chip. The design places larger metal particles against the cooler and smaller ones against the chip, creating a direct path for heat to travel through a resin base.

Why it mattersThis design aims to improve how efficiently heat is moved out of computer chips, which is a key factor in keeping devices running smoothly without overheating.

In the filing’s own words

Provided is a semiconductor package including a circuit board, a semiconductor chip on the circuit board, a heat dissipation member adjacent to the semiconductor chip, and a heat transmission member between the semiconductor chip and the heat dissipation member, the heat transmission member including a resin insulating body and phase change metal particles connected to each other in the resin insulating body, wherein the phase change metal particles connect the semiconductor chip and the heat dissipation member, the phase change metal particles being configured to transmit heat generated by the semiconductor chip to the heat dissipation member.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a circuit board; a semiconductor chip on the circuit board; a heat dissipation member adjacent to the semiconductor chip; and a heat transmission member between the semiconductor chip and the heat dissipation member, the heat transmission member comprising a resin insulating body and phase change metal particles connected to each other in the resin insulating body, wherein the phase change metal particles connect the semiconductor chip and the heat dissipation member, the phase change metal particles being configured to transmit heat generated by the semiconductor chip to the heat dissipation member, wherein the phase change metal particles comprise first phase change metal particles having a first diameter and second phase change metal particles having a second diameter that is smaller than the first diameter, and wherein the first phase change metal particles are in contact with a surface of the heat dissipation member, and the second phase change metal particles are in contact with a surface of the semiconductor chip.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Semiconductor package with a heat dissipation member and a heat transmission member comprising phase change metal particles
Patent number
US12772851B2
Application number
18512640
Filed
Nov 17, 2023
Granted
Oct 20, 2026
Inventors
5
Claims
19

Classified under

H10W 40/735 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 74/15 Electricity & electronicsH10W 74/40 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

More from Samsung in Chips & hardware

Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.