Samsung patents chip baking method using oxygen gas mix
This patent describes a way to make computer chips using extreme ultraviolet light. It involves baking the chip material in a chamber filled with a specific mix of oxygen and other gases to control how the material reacts.
In the filing’s own words
A manufacturing method of a semiconductor element includes: providing a photoresist on a wafer; supplying a first gas, containing oxygen, at a first flow rate to a bake chamber such that oxygen solubility of the photoresist becomes saturated, and supplying a second gas, which is oxygen-free, at a second flow rate to the bake chamber; and performing a bake process on the wafer in the bake chamber.
What exactly they claim (claim 1)
1. A manufacturing method of a semiconductor element, the manufacturing method comprising: providing a photoresist on a wafer; supplying a first gas, containing oxygen, at a first flow rate to a bake chamber, and supplying a second gas, which is oxygen-free, at a second flow rate to the bake chamber; and performing a bake process on the wafer in the bake chamber, wherein the supplying the first gas at the first flow rate comprises saturating oxygen solubility of the photoresist.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Manufacturing method of semiconductor element by using extreme ultra violet
- Patent number
- US12772808B2
- Application number
- 18210374
- Filed
- Jun 15, 2023
- Granted
- Oct 20, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10P 76/2041 Electricity & electronicsH10P 72/0432 Electricity & electronicsH10P 72/0602 Electricity & electronicsH10P 95/904 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.