Samsung patents chip bonding tool with adjustable spacing
Samsung has been granted a patent for a machine part used to join thin semiconductor layers together. The device uses a base with a groove and a plate with a bump that can move slightly to adjust the distance between the two layers being bonded.
In the filing’s own words
A substrate bonding apparatus may include a first bonding chuck including a first base and a first transformation plate, and a second including a second base facing the first bonding chuck. The first base may include a recess groove. The recess groove may be recessed inward from a surface on which the first transformation plate is mounted. The first transformation plate may include a first protrusion protruding outward from a first surface of the first transformation plate. A second surface of the first transformation plate may be opposite the first surface of the first transformation plate. The second surface of the first transformation plate may be configured to support a first substrate. The first transformation plate may be mounted on the first base in a manner allowing a distance between the first transformation plate and the first base to vary.
What exactly they claim (claim 1)
1. A substrate bonding apparatus comprising: a first bonding chuck configured to support a first substrate, the first bonding chuck including a first base and a first transformation plate; and a second bonding chuck configured to support a second substrate, the second bonding chuck including a second base facing the first bonding chuck, wherein the first base includes a recess groove, the recess groove is recessed inward from a surface of the first base on which the first transformation plate is mounted, the first transformation plate includes a first protrusion protruding outward from a first surface of the first transformation plate, a second surface of the first transformation plate is opposite the first surface of the first transformation plate, the second surface of the first transformation plate is configured to support the first substrate, and the first transformation plate is mounted on the first base in a manner allowing a distance between the first transformation plate and the first base to vary.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Substrate bonding apparatus and method of manufacturing semiconductor device using the same
- Patent number
- US12772778B2
- Application number
- 18415798
- Filed
- Jan 18, 2024
- Granted
- Oct 20, 2026
- Inventors
- 9
- Claims
- 18
Classified under
H10P 72/0428 Electricity & electronicsH10W 80/301 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.