Samsung patents layering method for magnetic memory chips
Samsung describes a structure for magnetic memory devices that uses specific chemical layers to guide the growth of a magnetic material. The design relies on a 'templating' layer to ensure the magnetic component aligns in a specific direction, which is crucial for how the data is stored.
In the filing’s own words
A magnetic memory device includes a substrate, a seed layer above the substrate, a chemical templating layer above the seed layer, and a first magnetic layer above the chemical templating layer. The seed layer includes Sc x N, Mn x N, or MgO substantially oriented in (001) direction. The chemical templating layer includes a binary alloy having a Cu 3 Au prototype structure or a BiF 3 prototype structure. The first magnetic layer includes a Heusler compound having perpendicular magnetic anisotropy.
What exactly they claim (claim 1)
1. A magnetic memory device comprising: a substrate; a seed layer above the substrate; a chemical templating layer above the seed layer, the chemical templating layer comprising a binary alloy having a Cu 3 Au prototype structure or a BiF 3 prototype structure; and a first magnetic layer above the chemical templating layer, the first magnetic layer comprising a Heusler compound having perpendicular magnetic anisotropy.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Templating layers for growth of perpendicularly magnetized heusler films
- Patent number
- US12772747B2
- Application number
- 18218926
- Filed
- Jul 6, 2023
- Granted
- Oct 20, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10N 50/85 Electricity & electronicsH10B 61/00 Electricity & electronicsH10N 50/01 Electricity & electronicsH10N 50/10 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.