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SamsungGranted patentChips & hardwareInterest 3/10

Samsung patents chip package using two-layer adhesive film

Patent drawing
Patent drawing from the official filing.

Samsung describes a semiconductor package that holds a chip to a base using two separate adhesive films. The film under the chip is the same size as the chip, while the film on the base is larger, creating a stepped structure between the two layers.

Why it mattersThis design improves how chips are attached to their base, which is a standard part of making computer processors and memory modules.

In the filing’s own words

A semiconductor package includes a package substrate, where a plurality of bonding pads are arranged on an upper surface of the package substrate; a semiconductor chip mounted on the upper surface of the package substrate, where a plurality of chip pads are arranged on an upper surface of the semiconductor chip; a first adhesive film attached to a lower surface of the semiconductor chip, wherein the first adhesive film having a first area corresponding to an area of the semiconductor chip; a second adhesive film attached to the upper surface of the package substrate, where the second adhesive film is joined to the first adhesive film, and the second adhesive film has a second area larger than the first area; a plurality of bonding wires; and a molding portion disposed on the upper surface of the package substrate.

What exactly they claim (claim 1)

1. A semiconductor package comprising: a package substrate, wherein a plurality of bonding pads are arranged on an upper surface of the package substrate; a semiconductor chip mounted on the upper surface of the package substrate, wherein a plurality of chip pads are arranged on an upper surface of the semiconductor chip; a first adhesive film attached to a lower surface of the semiconductor chip, wherein the first adhesive film has a first area when viewed in plan that is the same as an area of the lower surface of the semiconductor chip; a second adhesive film attached to the upper surface of the package substrate, wherein the second adhesive film is in direct contact with the first adhesive film, and the second adhesive film has a second area when viewed in plan larger than the first area; a plurality of bonding wires respectively connecting the plurality of bonding pads to the plurality of chip pads; and a molding portion disposed on the upper surface of the package substrate, the molding portion covering the semiconductor chip and the plurality of bonding wires.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Semiconductor package including an adhesive structure
Patent number
US12772462B2
Application number
18344927
Filed
Jun 30, 2023
Granted
Oct 20, 2026
Inventors
1
Claims
20

Classified under

H10B 80/00 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 72/073 Electricity & electronicsH10W 72/07338 Electricity & electronicsH10W 72/07352 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.