Samsung patents chip packaging method using light-sensitive glue
Samsung has been granted a patent for a specific way to build semiconductor packages. The design uses a light-sensitive epoxy resin to fill the gap between the chip and the base, along with a protective layer on the side of the chip's connection points.
In the filing’s own words
A semiconductor package and a method of fabricating the same. The semiconductor package includes a lower structure including a first lower conductive pad disposed on an upper surface thereof, a first semiconductor chip disposed on the lower structure, the first semiconductor chip including a first chip conductive pad disposed on a lower surface thereof, a solder ball connecting the first lower conductive pad and the first chip conductive pad, a photosensitive insulating layer filling a space between the lower structure and the first semiconductor chip, and a first organic insulating layer covering a side surface of the first chip conductive pad.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a lower structure including a first lower conductive pad disposed on an upper surface thereof; a first semiconductor chip disposed on the lower structure, the first semiconductor chip including a first chip conductive pad disposed on a lower surface thereof; a solder ball connecting the first lower conductive pad and the first chip conductive pad; a photosensitive insulating layer filling a space between the lower structure and the first semiconductor chip; and a first organic insulating layer covering a side surface of the first chip conductive pad, wherein the photosensitive insulating layer includes an epoxy resin, a dissolution inhibitor, a curing agent, and a filler.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package and method of fabricating the same
- Patent number
- US12772461B2
- Application number
- 18205721
- Filed
- Jun 5, 2023
- Granted
- Oct 20, 2026
- Inventors
- 2
- Claims
- 18
Classified under
H10B 80/00 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 72/01204 Electricity & electronicsH10W 72/01215 Electricity & electronicsH10W 72/01304 Electricity & electronicsH10W 72/01351 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.