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Samsung patents fridge cooling part with special heat-conducting filler

Patent drawing
Patent drawing from the official filing.

Samsung has been granted a patent for a cooling system that uses a thermoelectric element to move heat from inside a refrigerator to the outside. The design includes a specific material with directional heat-conducting fillers placed between the cooling element and metal plates to improve heat transfer efficiency.

Why it mattersThis filing details a specific mechanical improvement for how refrigerators manage heat, which is a standard part of appliance engineering rather than a new consumer feature.

In the filing’s own words

Disclosed is a thermoelectric element cooling device including: a thermoelectric element having an endothermic surface and an exothermic surface; a first heat dissipation plate connected to the endothermic surface and configured to dissipate heat to the endothermic surface; a first heat exchanger configured to transfer heat to the first heat dissipation plate; a second heat dissipation plate configured to dissipate heat received from the exothermic surface to a second heat exchanger; the second heat exchanger configured to release heat received from the second heat dissipation plate to the outside; and a thermoconductive member disposed at at least one position between the endothermic surface of the thermoelectric element and the first heat dissipation plate or between the exothermic surface and the second heat dissipation plate, wherein the thermoconductive member has: one side in contact with one of the surfaces of the thermoelectric element; and the other side in contact with the first heat dissipation plate or the second heat dissipation plate, the thermoconductive member includes a plurality of anisotropic, thermoconductive fillers, and at least one of the plurality of anisotropic, thermoconductive fillers is located adjacent to the one side and the other side.

What exactly they claim (claim 1)

1. A thermoelectric element cooling device comprising: a thermoelectric element including an endothermic surface and an exothermic surface; a first heat dissipation plate connected to the endothermic surface and configured to dissipate heat to the endothermic surface; a first heat exchanger configured to transfer heat to the first heat dissipation plate; a second heat dissipation plate configured to dissipate heat received from the exothermic surface; a second heat exchanger configured to release heat received from the second heat dissipation plate to the outside; and a thermoconductive member disposed at at least one of: a position between the endothermic surface of the thermoelectric element and the first heat dissipation plate or a position between the exothermic surface and the second heat dissipation plate, wherein the thermoconductive member has: one side in contact with one of the surfaces of the thermoelectric element; and the other side in contact with the first heat dissipation plate or the second heat dissipation plate, the thermoconductive member includes a plurality of anisotropic, thermoconductive fillers, and at least one anisoptropic, thermoconductive filler of the plurality of anisotropic, thermoconductive fillers is located adjacent to each of the one side and the other side.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Thermoelectric element cooling device and refrigerator comprising same
Patent number
US12768575B2
Application number
18923068
Filed
Oct 22, 2024
Granted
Oct 20, 2026
Inventors
3
Claims
15

Classified under

F25B 21/02 Mechanical engineeringF25B 2321/0251 Mechanical engineering
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.