Samsung patents stacked chip design with embedded connection points
Samsung describes a method for building 3D integrated circuits by stacking one chip die on top of another. The design uses a base layer with specific connection points that fit entirely within the footprint of the top chip, allowing for a compact, layered structure.
In the filing’s own words
A 3D integrated circuit structure includes a redistribution layer structure; a first semiconductor chip die on the redistribution layer structure; a plurality of core balls on the redistribution layer structure and adjacent the first semiconductor chip die; a molding material encapsulating the first semiconductor chip die and the plurality of core balls on the redistribution layer structure; an interconnection structure on the molding material; and a second semiconductor chip die on the interconnection structure. A footprint of the first semiconductor chip die and footprints of the plurality of core balls are within a footprint of the second semiconductor chip die.
What exactly they claim (claim 1)
1. A three-dimensional (3D) integrated circuit structure, comprising: a redistribution layer structure; a first semiconductor chip die on the redistribution layer structure; a plurality of core balls on the redistribution layer structure and adjacent the first semiconductor chip die; a molding material surrounding the first semiconductor chip die and the plurality of core balls; an interconnection structure on the molding material; and a second semiconductor chip die on the interconnection structure, wherein a footprint of the first semiconductor chip die and footprints of the plurality of core balls are within a footprint of the second semiconductor chip die, wherein the first semiconductor chip die comprises upper bonding pads.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- 3D integrated circuit (3DIC) structure and method for manufacturing the same
- Patent number
- US12765435B2
- Application number
- 18493166
- Filed
- Oct 24, 2023
- Granted
- Oct 13, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 90/701 Electricity & electronicsH10W 70/05 Electricity & electronicsH10W 70/093 Electricity & electronicsH10W 70/611 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/01 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.