Samsung patents chip packaging design using bridge dies and redistribution layers
This patent describes a method for building semiconductor packages by stacking multiple small chips, known as chiplets, on a base layer. It uses a specific arrangement of connection points and a 'bridge die' to link these components together before covering them with protective material.
In the filing’s own words
A semiconductor package may include a first redistribution layer structure, a chiplet structure on the first redistribution layer structure, a plurality of first connection members on the first redistribution layer structure, a first molding material on the first redistribution layer structure and molding the chiplet structure and the plurality of first connection members, and a second redistribution layer structure on the first molding material. The chiplet structure may include a third redistribution layer structure, a first chiplet and a second chiplet on the third redistribution layer structure, and a bridge die on a bottom surface of the third redistribution layer structure.
What exactly they claim (claim 1)
1. A semiconductor package, comprising: a first redistribution layer structure; a chiplet structure on the first redistribution layer structure; a plurality of first connection members on the first redistribution layer structure; a first molding material on the first redistribution layer structure and molding the chiplet structure and the plurality of first connection members; and a second redistribution layer structure on the first molding material, wherein the chiplet structure includes a third redistribution layer structure, a first chiplet and a second chiplet on the third redistribution layer structure, and a bridge die on a bottom surface of the third redistribution layer structure.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Semiconductor package and method for manufacturing the same
- Patent number
- US12765432B2
- Application number
- 18623645
- Filed
- Apr 1, 2024
- Granted
- Oct 13, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 90/401 Electricity & electronicsH10W 74/117 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/724 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.