Samsung patents chip package with built-in capacitors for better heat management
Samsung has been granted a patent for a semiconductor package design that places capacitors and support blocks between two layers of the chip structure. This arrangement uses specific areas for electrical contact and others for thermal management, with different parts of the device positioned over cooler or hotter zones.
In the filing’s own words
A semiconductor package includes a lower substrate that has a contact region and a non-contact region, a first upper substrate on the lower substrate, a lower device on the first upper substrate, a plurality of first solder balls between the first upper substrate and the lower substrate contact region, a plurality of capacitors between the first upper substrate and the lower substrate non-contact region, and a plurality of support blocks between the plurality of capacitors and the lower substrate non-contact region.
What exactly they claim (claim 1)
1. A semiconductor package, comprising: a lower substrate comprising a contact region and a non-contact region, wherein the contact region extends around the non-contact region, wherein the non-contact region comprises a first non-contact region and a second non-contact region adjacent to the first non-contact region; a first upper substrate on the lower substrate; a lower device on the first upper substrate, the lower device comprising a low-temperature region on the first non-contact region and a high-temperature region on the second non-contact region; a plurality of first solder balls between the first upper substrate and the contact region of the lower substrate; a plurality of capacitors between the first upper substrate and the non-contact region of the lower substrate; and a plurality of support blocks between the plurality of capacitors and the non-contact region of the lower substrate.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package
- Patent number
- US12765424B2
- Application number
- 18352177
- Filed
- Jul 13, 2023
- Granted
- Oct 13, 2026
- Inventors
- 3
- Claims
- 18
Classified under
H10W 90/00 Electricity & electronicsH10B 80/00 Electricity & electronicsH10D 1/68 Electricity & electronicsH10W 74/117 Electricity & electronicsH10W 90/701 Electricity & electronicsH10W 90/724 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.