Samsung patents chip package with laser-marked grid for identification
Samsung describes a semiconductor package design where a specific area on the chip's surface is marked with a laser. This marked section features a grid-like pattern of insulating material that exposes the underlying metal layers, creating a distinct visual or physical identifier on the package.
In the filing’s own words
A semiconductor package includes an encapsulation layer encapsulating at least one semiconductor chip, and a redistribution level layer disposed on the encapsulation layer. The redistribution level layer includes a redistribution layer and a redistribution insulating layer insulating the redistribution layer, a laser mark area is disposed on the redistribution layer and the redistribution insulating layer, and the redistribution insulating layer of the laser mark area comprises a plurality of mesh-type redistribution insulating patterns arranged apart from each other on a plane and surrounded by the redistribution layer. The redistribution level layer includes a laser mark insulating layer located on the redistribution layer and the redistribution insulating layer, wherein the laser mark insulating layer includes a laser mark exposing the redistribution layer and the mesh-type redistribution insulating patterns in the laser mark area.
What exactly they claim (claim 1)
1. A semiconductor package comprising: an encapsulation layer encapsulating at least a first semiconductor chip; a redistribution level layer disposed on the encapsulation layer, the redistribution level layer comprising a redistribution conductive layer and a redistribution insulating layer insulating the redistribution conductive layer; a laser mark insulating layer located on the redistribution conductive layer and the redistribution insulating layer; and a laser mark area comprising those portions of the redistribution conductive layer, the redistribution insulating layer, and the laser mark insulating layer that are formed within a first region of the semiconductor package with respect to a top down view, the redistribution insulating layer of the laser mark area comprising a plurality of mesh-type redistribution insulating patterns that are spaced apart from each other in a first horizontal direction and surrounded by the redistribution conductive layer, and the laser mark insulating layer of the laser mark area comprising a laser mark directly exposing the redistribution conductive layer and at least some of the mesh-type redistribution insulating patterns, wherein side surfaces of the mesh-type redistribution insulating patterns directly contact the redistribution conductive layer.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Semiconductor package including a laser mark area comprising portions of a redistribution level layer
- Patent number
- US12765391B2
- Application number
- 18131258
- Filed
- Apr 5, 2023
- Granted
- Oct 13, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10W 46/00 Electricity & electronicsB23K 26/364 Operations & transportH10B 80/00 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 74/121 Electricity & electronicsH10W 90/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.