Samsung patents new polymer for chip-making photoresists
Samsung has been granted a patent for a specific type of polymer used in photoresist, a material essential for creating microcircuits on computer chips. The invention describes a chemical structure that includes a sensitizer group and a protection group to help control how the material reacts to light during manufacturing.
In the filing’s own words
A polymer for photoresist and a photoresist composition including the polymer. The polymer for photoresist may include a polymerization unit comprising a sensitizer, and a protection group. The polymerization unit may include a structure of chemical formula 1: wherein R1 is hydrogen, a halogen element, a methyl group, a trifluoromethyl group, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted aryl group having 6 to 18 carbon atoms, or a substituted or unsubstituted arylalkyl group having 6 to 18 carbon atoms, and n is an integer of 1 to 100,000.
What exactly they claim (claim 1)
1. A polymer for photoresist, the polymer comprising: a first polymerization unit comprising a sensitizer group; and a protection group, wherein the first polymerization unit comprises a structure of chemical formula 1: wherein R 1 is hydrogen, a halogen element, a methyl group, a trifluoromethyl group, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted aryl group having 6 to 18 carbon atoms, or a substituted or unsubstituted arylalkyl group having 6 to 18 carbon atoms, and n is an integer of 1 to 100,000; and wherein the first polymerization unit further comprises at least one of a unit of chemical formula 3 and a unit of chemcial formula 4: 1 is an integer of 1 to 100,000, and k is an integer of 1 to 100,000.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Polymers for photoresist and photoresist compositions including the same
- Patent number
- US12761560B2
- Application number
- 17826234
- Filed
- May 27, 2022
- Granted
- Oct 13, 2026
- Inventors
- 7
- Claims
- 16
Classified under
G03F 7/0397 Physics & computingC08F 214/18 Chemistry & metalsC08F 220/1806 Chemistry & metalsC08F 220/301 Chemistry & metalsC08F 226/02 Chemistry & metalsC08F 228/02 Chemistry & metalsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.