Samsung patents chip packages with shorter dummy posts for better stacking
Samsung has been granted a patent for a semiconductor package design that includes shorter, non-conductive 'dummy' posts alongside the main electrical connections. These dummy posts are shorter than the active conductive posts and are not wired into the circuit, serving a structural role within the chip's packaging layers.
In the filing’s own words
A semiconductor package according to an example embodiment of the present disclosure comprises: a lower redistribution structure including an insulating layer, a connection pad disposed on an upper surface of the insulating layer, and an upper pad; a semiconductor chip mounted on the lower redistribution structure and connected to the upper pad; a conductive post disposed on the connection pad; at least one dummy post disposed on the lower redistribution structure; and an upper redistribution structure disposed on the semiconductor chip and connected to the conductive post, and a height of the at least one dummy post is smaller than a height of the conductive post.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a lower redistribution structure comprising an insulating layer, a connection pad and an upper pad, wherein the connection pad and the upper pad are disposed on an upper surface of the insulating layer; a semiconductor chip mounted on the lower redistribution structure and connected to the upper pad; a conductive post disposed on the connection pad; at least one dummy post disposed on the lower redistribution structure; and an upper redistribution structure disposed on the semiconductor chip and connected to the conductive post, wherein a height of the at least one dummy post is less than a height of the conductive post, wherein the at least one dummy post is not electrically connected to the lower redistribution structure and the upper redistribution structure.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor packages having dummy posts
- Patent number
- US12757803B2
- Application number
- 18216157
- Filed
- Jun 29, 2023
- Granted
- Oct 6, 2026
- Inventors
- 3
- Claims
- 19
Classified under
H10W 90/701 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/117 Electricity & electronicsH10B 80/00 Electricity & electronicsH10W 74/15 Electricity & electronicsH10W 90/00 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.