Samsung patents chip package using metal paste to connect layers
Samsung describes a semiconductor package where a chip is stacked on a wiring layer using bump structures. Each bump has a metal pillar with a metal paste coating that bonds to the wiring layer's pads.
In the filing’s own words
A semiconductor package includes a semiconductor device including a substrate, bonding pads provided on a front surface of the substrate and bump structures provided on the bonding pads respectively, each of the bump structures having a metal pillar and a metal paste coated on one end portion of the metal pillar; and a wiring layer including a metal wiring layer having redistribution pads and a protective layer on the metal wiring layer and having recesses that expose at least portions of the redistribution pads. The semiconductor device is stacked on the wiring layer via the bump structures. Portions of the bump structures are respectively disposed in the recesses of the protective layer, and the metal pastes are respectively bonded to the redistribution pads.
What exactly they claim (claim 1)
1. A semiconductor package, comprising: a semiconductor device including: a substrate, bonding pads provided on a front surface of the substrate, and bump structures provided on the bonding pads respectively, each of the bump structures having a metal pillar and a metal paste coated on an end portion of the metal pillar; and a wiring layer including: a metal wiring layer having redistribution pads, and a protective layer on the metal wiring layer, the protective layer defining recesses that expose at least portions of the redistribution pads, wherein the semiconductor device is stacked on the wiring layer via the bump structures, wherein portions of the bump structures are respectively disposed in the recesses of the protective layer, and wherein the metal paste is bonded to the redistribution pad.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package and method of manufacturing the same
- Patent number
- US12757796B2
- Application number
- 18614964
- Filed
- Mar 25, 2024
- Granted
- Oct 6, 2026
- Inventors
- 5
- Claims
- 20
Classified under
H10W 90/00 Electricity & electronicsH10W 70/685 Electricity & electronicsH10W 74/121 Electricity & electronicsH10W 76/60 Electricity & electronicsH10W 70/60 Electricity & electronicsH10W 72/223 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.