Samsung patents chip stack design with built-in support base
Samsung has been granted a patent for a semiconductor package that uses a smaller chip embedded in plastic as a structural base. Larger chips are then stacked on top of this base and other supporting chips to create a compact, multi-layered unit.
In the filing’s own words
Provided is a semiconductor package including a preformed support structure. The semiconductor package includes a substrate, the preformed support structure provided on the substrate, the preformed support structure including a first chip encapsulated with a first molding material, a plurality of second chips, at least one of the second chips being provided on the preformed support structure, and a third chip provided on the second chips, wherein the first chip has a first size, each of the second chips has a second size, the third chip has a third size, and the first size is smaller than the second size and the third size, and wherein a top surface of the at least one of the second chips is at the same height level as top surfaces of other ones of the second chips.
What exactly they claim (claim 1)
1. A semiconductor package, comprising: a substrate; a support structure provided on the substrate, the support structure comprising a first chip encapsulated with a first molding material; a plurality of second chips, at least one of the plurality of second chips being provided on the support structure; and a third chip provided on the plurality of second chips, wherein the first chip has a first size, a first second chip of the plurality of second chips has a second size, a second second chip of the plurality of second chips has the second size, the third chip has a third size, wherein the first size is smaller than the second size and the third size, and wherein a top surface of the at least one of the plurality of second chips is at a same height level as top surfaces of other ones of the plurality of second chips.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package including preformed support structure
- Patent number
- US12757779B2
- Application number
- 18372355
- Filed
- Sep 25, 2023
- Granted
- Oct 6, 2026
- Inventors
- 1
- Claims
- 20
Classified under
H10W 74/117 Electricity & electronicsH10W 74/016 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 72/0198 Electricity & electronicsH10W 90/722 Electricity & electronicsH10W 90/724 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.