Samsung patents chip package with built-in alignment keys
Samsung has been granted a patent for a semiconductor package design that includes specific metal structures called alignment keys. These keys run through the chip's protective layers to help position components correctly during manufacturing, while separate solder connections handle the electrical signals.
In the filing’s own words
Provided is a semiconductor package including a first redistribution substrate including a first redistribution insulating layer and a first redistribution via, a first insulating layer on the first redistribution substrate, a solder pad on the first insulating layer, a first alignment key penetrating the first insulating layer and extending to an inside of the first redistribution insulating layer, and a solder via spaced apart from the first alignment key and electrically connected to the solder pad, wherein the first alignment key includes a first key body extending from a first surface of the first insulating layer to the inside of the first redistribution substrate, and a first key protrusion protruding from a side surface of the first key body toward the first insulating layer, and wherein the first insulating layer includes a non-photosensitive material.
What exactly they claim (claim 1)
1. A semiconductor package comprising: a first redistribution substrate comprising a first redistribution insulating layer and a first redistribution via; a first insulating layer on the first redistribution substrate; a solder pad on the first insulating layer; a first alignment key penetrating the first insulating layer and extending to an inside of the first redistribution insulating layer; and a solder via spaced apart from the first alignment key and electrically connected to the solder pad, wherein the first alignment key comprises a first key body extending from a first surface of the first insulating layer to the inside of the first redistribution substrate, and a first key protrusion protruding from a side surface of the first key body toward the first insulating layer, and wherein the first insulating layer comprises a non-photosensitive material.
Facts
- Company
- Samsung (SAMSUNG ELECTRONICS CO., LTD.)
- Official title
- Semiconductor package
- Patent number
- US12757745B2
- Application number
- 18596207
- Filed
- Mar 5, 2024
- Granted
- Oct 6, 2026
- Inventors
- 3
- Claims
- 20
Classified under
H10W 46/00 Electricity & electronicsH10W 70/65 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 90/401 Electricity & electronicsH10W 46/301 Electricity & electronicsH10W 74/10 Electricity & electronicsMore from Samsung in Chips & hardware
- Samsung patents chip that combines camera and screen Oct 13, 2026
- Samsung patents faster chip testing using machine learning Sep 1, 2026
- Samsung patents radar method to pinpoint target direction more accurately Sep 1, 2026
- Samsung patents memory chip that searches data by content, not address Sep 1, 2026
- Samsung patents chip design that skips empty data to speed up AI Sep 1, 2026
Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.