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Samsung patents chip method using split exposures for better alignment

Patent drawing
Patent drawing from the official filing.

This patent describes a way to make computer chips by splitting a large image into two smaller parts. It uses reference marks on the first layer to ensure the top and bottom parts line up perfectly during manufacturing.

Why it mattersIt helps manufacturers create more precise chips, which is a routine but important step in making faster processors.

In the filing’s own words

A method of manufacturing a semiconductor device includes forming a first layer on a wafer through a single shot exposure, a single shot of the first layer including first overlay marks; forming a second layer and a first photoresist film on the first layer; and performing an upper shot exposure and a lower shot exposure onto the first photoresist film based on a first overlay function of the single shot of the first layer generated based on absolute measurement of the first overlay marks. An upper shot transferred by the upper shot exposure and a lower shot transferred by the lower shot exposure are identical to each other, and an area of each of the upper shot and the lower shot is less than an area of the single shot of the first layer.

What exactly they claim (claim 1)

1. A method of manufacturing a semiconductor device, the method comprising: forming a first layer on a wafer through a single shot exposure, a single shot of the first layer including first overlay marks; forming a second layer and a first photoresist film on the first layer; and performing an upper shot exposure and a lower shot exposure onto the first photoresist film based on a first overlay function of the single shot of the first layer generated based on absolute measurement of the first overlay marks, wherein an upper shot transferred by the upper shot exposure and a lower shot transferred by the lower shot exposure are identical to each other, and an area of each of the upper shot and the lower shot is less than an area of the single shot of the first layer.

Facts

Company
Samsung (Samsung Electronics Co., Ltd.)
Official title
Method of manufacturing semiconductor device
Patent number
US12757741B2
Application number
18051639
Filed
Nov 1, 2022
Granted
Oct 6, 2026
Inventors
2
Claims
8

Classified under

H10W 46/00 Electricity & electronicsH10P 50/691 Electricity & electronicsH10W 46/301 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.