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Samsung patents camera sensor stack with protective dam for wires

Samsung describes a camera sensor package where a logic chip sits under the image sensor, connected by thin wires. A small wall called a dam structure covers part of these wires to keep them separate from the sensor and protect them under a cover glass.

Why it mattersThis design helps protect delicate wiring in camera modules, which is a standard improvement in how phone cameras are built.

In the filing’s own words

An image sensor package includes a package substrate, a logic chip mounted on the package substrate and having a central region and an edge region, an image sensor chip mounted on the central region of the logic chip, a bonding wire electrically interconnecting the package substrate to the logic chip and bonded to the edge region of the logic chip, a dam structure disposed in the edge region of the logic chip to cover a portion of the bonding wire, a cover glass disposed on the dam structure, and an encapsulation structure encapsulating the bonding wire on the package substrate.

What exactly they claim (claim 1)

1. An image sensor package, comprising: a package substrate; a logic chip mounted on the package substrate and including a central region and an edge region; an image sensor chip mounted on the central region of the logic chip; a bonding wire electrically interconnecting the package substrate to the logic chip, the bonding wire bonded to the edge region of the logic chip; a dam structure disposed in the edge region of the logic chip and covering a portion of the bonding wire; a cover glass disposed on the dam structure; and an encapsulation structure encapsulating the bonding wire on the package substrate, wherein the encapsulation structure and the image sensor chip is separated by the dam structure.

Facts

Company
Samsung (SAMSUNG ELECTRONICS CO., LTD.)
Official title
Image sensor package including a chip stack structure
Patent number
US12757506B2
Application number
18338933
Filed
Jun 21, 2023
Granted
Oct 6, 2026
Inventors
1
Claims
10

Classified under

H10F 39/804 Electricity & electronicsH10F 39/811 Electricity & electronicsH10W 74/117 Electricity & electronicsH10W 90/00 Electricity & electronicsH10W 72/07254 Electricity & electronicsH10W 72/247 Electricity & electronics
Read the full filing (official PDF) ↗ Open in the Patent Tracker

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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.