Samsung patents chip design using 2D materials and metal particles
Samsung has secured a patent for a semiconductor device that uses a thin, two-dimensional material layer as its core component. The design incorporates specific metallic nanoparticles, such as ruthenium or molybdenum, placed on the material layer to help control the flow of electricity between the source and drain electrodes.
In the filing’s own words
A semiconductor device may include a two-dimensional material layer including a two-dimensional semiconductor material having a polycrystalline structure; metallic nanoparticles partially on the two-dimensional material layer; a source electrode and a drain electrode respectively on both sides of the two-dimensional material layer; and a gate insulating layer and a gate electrode on the two-dimensional material layer between the source electrode and the drain electrode.
What exactly they claim (claim 1)
1. A semiconductor device comprising: a two-dimensional material layer including a two-dimensional semiconductor material having a polycrystalline structure; metallic nanoparticles partially on the two-dimensional material layer; a source electrode and a drain electrode respectively on both sides of the two-dimensional material layer; and a gate insulating layer and a gate electrode on the two-dimensional material layer between the source electrode and the drain electrode, wherein the metallic nanoparticles comprise Ru, RuO, Mo, W, TiN, or Ti.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Semiconductor device including two-dimensional material and method of fabricating the same
- Patent number
- US12757463B2
- Application number
- 18350433
- Filed
- Jul 11, 2023
- Granted
- Oct 6, 2026
- Inventors
- 4
- Claims
- 20
Classified under
H10D 62/80 Electricity & electronicsH10D 30/43 Electricity & electronicsH10D 30/6212 Electricity & electronicsH10D 30/6757 Electricity & electronicsH10D 99/00 Electricity & electronicsH10D 62/40 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.