Samsung patents chip design with hollow landing pads
This patent describes a specific layout for semiconductor memory chips that uses a two-part connection point, or landing pad, between internal components. The upper part of this connection contains a small hollow space, or cavity, filled with a conductive material to help electrical signals pass through the chip.
In the filing’s own words
A semiconductor device includes a substrate including an active region; a cell gate structure disposed in the substrate, crossing the active region, and extending in a first horizontal direction; bitline structures crossing the cell gate structure and extending in a second horizontal direction intersecting the first horizontal direction; a contact plug disposed between the bitline structures; a landing pad structure disposed on the contact plug and including a lower landing pad and an upper landing pad on the lower landing pad, wherein the upper landing pad includes a cavity; a conductive pattern disposed in the cavity of the upper landing pad; and an insulating pattern structure in contact with one of the bitline structures and in contact with the landing pad structure.
What exactly they claim (claim 1)
1. A semiconductor device, comprising: a substrate including an active region; a cell gate structure disposed in the substrate, crossing the active region, and extending in a first horizontal direction; bitline structures crossing the cell gate structure and extending in a second horizontal direction intersecting the first horizontal direction; a contact plug disposed between the bitline structures; a landing pad structure disposed on the contact plug and including a lower landing pad and an upper landing pad on the lower landing pad, the upper landing pad including a cavity; a conductive pattern disposed in the cavity of the upper landing pad; and an insulating pattern structure in contact with one of the bitline structures and in contact with the landing pad structure.
Facts
- Company
- Samsung (Samsung Electronics Co., Ltd.)
- Official title
- Semiconductor devices having landing pad structures
- Patent number
- US12757386B2
- Application number
- 18391828
- Filed
- Dec 21, 2023
- Granted
- Oct 6, 2026
- Inventors
- 6
- Claims
- 20
Classified under
H10B 12/485 Electricity & electronicsH10B 12/315 Electricity & electronicsH10B 12/482 Electricity & electronicsMore from Samsung in Chips & hardware
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Summaries are simplified from the filing’s own abstract and first claim. A patent filing is not a product announcement.
Patent data and drawings: U.S. Patent and Trademark Office (USPTO). Nebula is not affiliated with or endorsed by the USPTO.